Mounting components to a hardware casing

ABSTRACT

Methods, systems, and media to mount one or more components to a hardware casing are disclosed. Embodiments include hardware and/or software for determining a pattern of interconnects to apply to an interior surface of the hardware casing. The pattern includes at least one independent path for transmitting a signal between the components. The pattern of interconnects is then applied to the interior surface, the application being configured for the topography of the interior surface to couple the components with the pattern of interconnects. In many embodiments, the components may then be mounted to the casing and interconnected with the interconnects. And, in some embodiment, the pattern of interconnects may be coupled with a circuit board having additional components.

CROSS-REFERENCE TO RELATED APPLICATION

Pursuant to 35 USC § 121, this divisional application claims priority toand benefit of U.S. Utility patent application Ser. No. 10/782,455,filed Feb. 19, 2004, on behalf of inventors Kaply et al., entitled“MOUNTING COMPONENTS TO A HARDWARE CASING”.

FIELD OF INVENTION

The present invention is in the field of computer hardware architecture.More particularly, the present invention relates to methods andarrangements to mount one or more components to a hardware casing and tointerconnect the components with a pattern of interconnects applied tothe hardware casing.

BACKGROUND

Electronic components are often assembled and interconnected on a flatsurface known as a circuit board. Circuit boards are typically dividedinto two broad categories: those intended for prototype or experimentalcircuits; and those intended for production or commercial sale. Circuitboards used for experimental work are often referred to as breadboards,which allow engineers to construct circuits quickly and often withoutregard to efficiency of component layout. In contrast, circuit boardsintended for commercial sale typically have highly reliable wires andinterconnects, permanent bonds to all components, or at least theirmounts, and topographies amenable to mass production and thoroughtesting. Further, these circuit boards are typically made of a materialthat is reliable, low-cost, and easy to manufacture, typically afiberglass substrate with copper wires etched from laminated coppersheets. Components are permanently affixed to production boards using asoldering process. The Digilab board is a simple example of such aboard.

Though printed circuit board design of a circuit board intended forproduction involves many considerations including circuit timing issues,voltage dividers, capacitive reactance, crosstalk simulations, and powersupply voltages, these circuit boards offer several advantages such asconsistency and modularity. A circuit board serves as a consistent,uniform surface on which to design. Additionally, after a circuit boardhas been designed, it may be included within innumerable exteriors,which are typically more economical to redesign than a circuit boarddesign. As well, a circuit board may be small enough to serve as amodular component of a larger system, for example, a module of randomaccess memory (RAM).

Devices, however, are progressing toward smaller sizes and, as a result,designers are pressed to condense the space requirements of the circuitboards and components while maintaining the organizational advantages.Further, more and more devices are being automated by incorporatingcircuit boards for increased functionality, many of which involve adiminutive size and weight to be incorporated feasibly. For example, theoperable ease and usefulness of a combined personal digital assistant(PDA) and mobile phone may depend on the size.

Additionally, the ability to reduce size and weight of a circuit boarddevice would facilitate further designs. For example, many times sizerestrictions may be imposed on a design engineer of a subcomponent of alarger system or a subcomponent to upgrade or improve an existingsystem. If the design engineer succeeds in including more effectivecircuitry with increased functionality into less space with less weight,the design engineer may accommodate a more robust product.

The resulting size of a design is limited by the size of the componentsnecessary to implement the design as well as the circuit board(s).Components may include independently manufactured circuits, chips, orthe like, to plug into the circuit board of the device and are typicallycombined with interconnects. Interconnects typically includeelectrically conductive material to carry electrical signals for powerand/or communications between components.

One common type of component mounted on circuit board devices is asensor. The design and manufacture of many sensors may involve highlyspecialized knowledge and techniques. As design engineers reduce thesize of the sensors, the size of circuit boards adapted to interconnectthe sensors with other components becomes a more significant designfactor. When size is significant, because a circuit board device may notbe reduced beyond the dimensions of its circuit board, some size orweight-sensitive devices may not feasibly incorporate a circuit board.Thus, such devices may not feasibly include some desired functionality.

In some cases, the inability to reduce a circuit board device is acritical problem. For example, currently because of size reductionrestrictions, a pacer generator may be felt under the skin and a slightdeformity of the skin can be visually noticed.

A solution to reduce size and weight of a circuit board device has beento fit more components onto a smaller circuit board by situatingmultiple layers of interconnects within an insulating material toconnect components. However, this solution is not effective, forexample, in a circumstance of very few components, layering theinterconnects does not substantially condense the size or reduce theweight.

Therefore, there is a need for methods and arrangements capable ofreducing size and weight of devices that include components andinterconnects.

SUMMARY OF THE INVENTION

The problems identified above are addressed by methods and arrangementsto mount components to a hardware casing. One embodiment provides amethod to fasten components to a hardware casing of a device. The methodgenerally includes designing, manufacturing, assembling, or the like, apattern of interconnects which may be applied to an interior surface ofthe hardware casing. For this method, the pattern of interconnectsprovides a path for transmitting a signal between the components to bemounted. Also, for this method, the pattern is designed to be able tomount the components to the interior surface of the hardware casingbased on the topography of the interior surface. The method furtherincludes applying the pattern of interconnects to the interior surface.The pattern is applied in such a way that, on the interior surface, thecomponents are able to be coupled with the pattern of interconnectsbased upon the topography of the interior surface.

An additional embodiment provides a hardware casing for mountingcomponents of a device. The hardware casing includes a pattern ofinterconnects applied to an interior surface of the hardware casingbased on the topography or physical features of the interior surface.The pattern of interconnects on the interior surface is capable oftransmitting signals, particularly providing a path for transmitting asignal between the components. The hardware casing also includesmounting sites designed to mount the components to the interior surfaceand coupled with the pattern of interconnects. Within the hardwarecasing, the mounting sites are positioned based upon the topography ofthe interior surface.

A further embodiment provides a system that includes a device encased bya hardware casing. The system involves components that are manufacturedindependently and capable of performing separate functions of thedevice. In addition, the system includes a pattern of interconnectsapplied to an interior surface of the hardware casing. In this system,the pattern includes a path for transmitting a signal between componentsmounted on the hardware casing and independently manufactured anddesigned to perform separate functions. Moreover, the pattern ofinterconnects is fastened to the casing based upon a topography of theinterior surface. Further, the system typically includes mounting sitesto couple the components to the interior surface. In this system, themounting sites are coupled with the pattern of interconnects andpositioned based upon the topography.

BRIEF DESCRIPTION OF THE DRAWINGS

Other objects and advantages of the invention will become apparent uponreading the following detailed description and upon reference to theaccompanying drawings in which, like references may indicate similarelements:

FIG. 1 depicts an embodiment of an audio device having one or morecomponents interconnected and mounted via a hardware casing;

FIG. 2 depicts a portable computer that includes a bottom casing uponwhich a pattern of interconnects has been applied to mount components tolessen the weight and size of the portable computer;

FIG. 3 depicts interconnects applied to a hardware casing via a thinlaminate to be adhered to a hardware casing;

FIG. 4 depicts an embodiment of a pliable keyboard made of flexible,nonconductive material;

FIG. 5 depicts an embodiment of a sports watch having a pattern ofinterconnects applied to the casing of the watch and components mountedto the casing;

FIG. 6 depicts an embodiment of a PDA having a section of casing withcomponents and interconnects; and

FIG. 7 depicts an example of a flow chart to apply a pattern ofinterconnects and mount components onto a hardware casing.

DETAILED DESCRIPTION OF EMBODIMENTS Introduction

The following is a detailed description of embodiments of the inventiondepicted in the accompanying drawings. The embodiments are in suchdetail as to clearly communicate the invention. However, the amount ofdetail offered is not intended to limit the anticipated variations ofembodiments, but on the contrary, the intention is to cover allmodifications, equivalents, and alternatives falling within the spiritand scope of the present invention as defined by the appended claims.The detailed descriptions below are designed to make such embodimentsobvious to a person of ordinary skill in the art.

Generally speaking, methods and arrangements are contemplated to mountone or more components to a hardware casing. In one embodiment, one ormore components are mounted to a casing to reduce space and weight of acircuit board within the casing. Interconnects are applied to the casingto provide connections over which multiple components may transmitsignals. The interconnects may be applied by painting conductive linesonto the casing, coating the casing with a metal and/or etchingconductive lines from the metal, adhering a laminate to the casing onwhich the interconnects are printed, among other possibilities.

In many embodiments, interconnects may be applied and components may bemounted to the hardware casing to supplement circuitry of circuit boardswithin the device. Locations to mount components may be selected basedupon the type and function as well as the shape of the component forease of mounting and interconnection with other components. Mountingcomponents onto the casing lends the advantage of coupling to thepattern of interconnects directly through the casing to a particularcomponent, a sensor, to be located on the exposed side of the casing.

DETAILED DESCRIPTION

Turning now to the drawings, FIG. 1 depicts an embodiment of a system tomount one or more components to a hardware casing. In FIG. 1, the systemincludes an audio device (100) such as a digital voice recorder or anMP3 player. Audio device (100) includes components mounted to andcommunicatively coupled via a pattern of interconnects on a hardwarecasing (105). Audio device (100) saves space and weight by reducingspace and weight of at least part of a circuit board by mountingcomponents to a hardware casing (105), using hardware casing (105) and abottom casing (102) to function as a circuit boards as well as anenclosure.

Hardware casing (105) and bottom casing (102) is composed of a materialthat does not conduct current. Therefore, hardware casing (105)insulates a user who may be in contact with hardware casing (105) orbottom casing (102) from electrical power and control signalstransmitted via the pattern of interconnects and insulates theindependent paths of interconnects from one another. For instance,hardware casing (105) may be a plastic.

Hardware casing (105) and bottom casing (102) may also conduct heat,dissipating heat generated by operation of the components via directcontact with the components. In some embodiments, heat sinks may bedesigned into the hardware casing (105) and/or bottom casing (102) atmounts for components to accelerate heat dissipation.

Hardware casing (105) may include components such as switches (106).Switches (106) may be touch buttons, advantageously thinner than manyother buttons, to accommodate a smaller interior space of audio device(100). For instance, in some embodiments, switches (106) may includethin optical switches. The optical switches may toggle in response tochanges in light sensed by the switches. For example, switches (106) mayinclude an infrared sensing beam and a slight cavity. When an infraredsensing beam is interrupted by a user's finger in the touch area locatedin the yoke of the slight cavity, the switch may recognize operation bya user and generate an output in response. In such embodiments, audiodevice (100) may include circuitry that responds to a change in state ofthe optical switches internal to audio device (100) to initiaterecording, stop recording, play a recording, or other related functions.

In another embodiment, switches (106) may be pressure sensitive. In suchembodiments, switches (106) may be coupled with a pattern ofinterconnects on an interior surface (not shown) of the hardware casing(105) to integrate functionality of switches (106) with other componentsof audio device (100). In a further embodiment, switches (106) may be abutton functioning via a capacitive touch switch.

Bottom casing (102) may include a pattern of interconnects such asinterconnects (104) on a thin plate and mounting sites where components(103) such as chips and other electronic devices are mounted. Bottomcasing (102) complements hardware casing (105) to enclose components(103) and a pattern of interconnects (104) of audio device (100). Bottomcasing (102) also functions as a circuit board for one or morecomponents (103) and the pattern of interconnects (104). In otherembodiments, bottom casing (102) is not necessarily at the base of audiodevice (100), but merely a portion of the casing that also serves as acircuit board.

Mounting sites of bottom casing (102) provide a location where acomponent may be added and be connected with the pattern ofinterconnects (104). In one embodiment, mounting sites include mounts,while in other embodiments, mounting sites may be a broadening of aninterconnect on which a component may be placed. In further embodiments,a mounting site is a location where some metal is spread for a componentto be placed on top of it. The metal is then heated to melt into thecomponent and electrically couple the metal and component together.

The material of bottom casing (102) may be constructed of a materialsufficient to support and protect audio device (100) such as a resilientplastic. To add to the slenderness of the device, a thin battery (notshown) may power the circuitry of audio device (100) and contribute to areduced width of audio device (100). In one embodiment, the thin batterymay be a small rectangular polymer coated with an anode and cathode, forexample, the Power Paper Standard Cell STD-2. Further, multiplebatteries may be interconnected in series and/or in parallel forincreased voltage and/or current requirements.

Components (103) may include independently manufactured electronicdevices that may include circuits, integrated circuits, and the like. Inone embodiment, audio device (100) may utilize components such as aprocessor, a microphone, a speaker, and a display. The microphone maycouple with a component such as an analog to digital (A/D) converter toconvert analog voice signals into digital data for storage in a memorycomponent. In several embodiments, components (103) also includeinterfaces for external components such as external microphones, earpieces, or storage devices.

Further, components (103) may include sensors (not shown) that detectenvironmental conditions, or conditions external to audio device (100).Sensors may be mounted several places on the bottom casing (102),including, for example, on the outside surface (109) of audio device(100), opposite from the interior surface (108). Alternatively, sensorsmay be coupled with the interior surface (108) of bottom casing (102)and may be sensitive to changing environmental conditions via a directcoupling with bottom casing (102). For example, audio device (100) mayinclude a heart beat monitor and include a strap for an arm or wrist ofthe user, allowing the user to listen to a recording and monitor theuser's heart rate while jogging.

Interconnects (104) include electrically conducting material to transmitsignals between two or more components (103). The application ofinterconnects (104) to bottom casing (102) is further discussed withrespect to FIG. 2.

Utilizing bottom casing (102) and hardware casing (105) as both theenclosure and the circuit boards, advantageously reduces the weight andspace typically added by independent circuit boards. The weight and sizereduction can be implemented in new designs and in retrofits of currentdesigns.

Turning now to FIG. 2, a portable computer (200) is shown that includesa bottom casing (202) providing a supportive base to which a pattern ofinterconnects (206) have been applied and one or more components (208)have been mounted. To lessen the weight and size of portable computer(200), the components and interconnects are included on the casing whichreduce the size of a motherboard or, in some embodiments, eliminates aninternal circuit board.

Interconnects (206) may be applied to the bottom casing (202) ofportable computer (200) in a variety of ways. In one embodiment,interconnects (206) are printed onto bottom casing (202) by applying avery thin covering of metal (204), typically copper. Then, wire patternsin the configuration of interconnects (206) may be printed onto themetal surface using a compound that resists etching. Next, the bottomcasing (202) may be subjected to a chemical etching process that removesexcess metal. The remaining unetched metal may form wires thatinterconnect components and small pads that define regions wherecomponent leads may be attached. In one embodiment, this process isconducted with a circuit computer-aided manufacturing software programused to design products such as electronic circuit boards in computersand other devices. For example, LPKF CAD/CAM Systems, using aBoardMaster program to control operation of a circuit manufacturemachine, may produce the pattern of interconnects on the interiorsurface of the hardware casing.

In another embodiment, interconnects (206) may be applied with a meshscreen. Via a mesh screen, a solder mask may be applied to a printedcircuit board by forcing the solder through the screen and onto theboard to form interconnects (206). As well, in some embodiments,interconnects (206) may be applied by hand-painting a conductivematerial onto the casing (202).

In further embodiments, as illustrated in FIG. 3, a pattern ofinterconnects (308) may be applied to a hardware casing (304) via with avery thin laminate (302). Laminate (302) may provide a regular surfaceon which to apply the pattern of interconnects (308) and then thelaminate is attached to hardware casing (304). In some embodiments,laminate (302) is a flexible material that conforms to the contours ofthe hardware casing (304). In other embodiments, laminate (302) maybecome flexible and conforms to the contours of hardware casing (304)with an application of, e.g., heat and/or chemicals.

Laminate (302) is then coupled with the casing (304). In severalembodiments, laminate (302) is glued to the (304). Then components (306)are mounted to the hardware casing (304), coupling the components (306)with the pattern of interconnects (308). A person of ordinary skill inthe art will readily observe that the pattern of interconnects (308) maybe applied to laminate (302) with several techniques. In one embodiment,interconnects (308) are painted onto the laminate (302). In anotherembodiment, interconnects (308) are applied to the laminate (302) byprinting and etching a path of connections to connect components (306)to be mounted onto the laminate (302), analogous to the process in FIG.2.

Turning now to FIG. 4, there is shown an embodiment of a pliablekeyboard (400) made of flexible, nonconductive material. FIG. 4illustrates that in one embodiment of the present invention, a patternof interconnects is printed directly onto a casing instead of onto acircuit board, advantageously reducing the weight and thickness of thekeyboard (400) by removing the necessity of mounting the circuit board.The type of casing is not limited; it may be any size, shape,pliability, or the like.

In one embodiment, the pliable keyboard (400) is made of rubber that maybe rolled up or folded without destroying the functionality of thekeyboard (400). The pattern of interconnects is then painted onto aninterior surface of the rubber keyboard with a pliable, conductivepaint. Keyboard (400) may be used in conjunction with a PDA, handheldcomputer, mobile telephone, cash register, or the like. Embodiments arecapable of utilizing a non-flat surface for a hardware casing on whichinterconnects may be imprinted.

FIG. 5 depicts a sports watch (500) as an embodiment of another systemwith interconnects applied and components mounted to its hardwarecasing. Sports watch (500) includes one component as a sensor (502) todetect environmental conditions, for example, a wearer's temperature.Sensor (502) may be located on another side of the hardware casing thanthe mounted components. Accordingly, sensor (502) is convenientlycoupled with the interconnects directly through the hardware casing.

In further embodiments, sports watch (500) may include a mobiletelephone that a person may strap onto his body to both keep connectedwith conversations and maintain knowledge of the person's bodytemperature, periodic blood pressure, or the like, in a lightweightfashion. In further embodiments, the form factor, or size,configuration, or physical arrangement, may also include semi-permanentcurvature, such as a cuff bracelet within which is a mobile telephone,recorder, computer, or MP3 player, for example.

Turning now to FIG. 6, it is shown an embodiment of a PDA (600) whichmay also be a handheld computer or a combination of a cell phone withfurther processing capabilities. In one embodiment, PDA (600) includes asection of its casing (602) having components such as a processor (604)and memory (606) coupled with a pattern of interconnects (610).Including circuitry on the casing reduces weight and space by allowingthe casing to support and organize the circuitry inside PDA (600). Insome embodiments, PDA (600) includes mounts such as mount (608) tointerconnect a component (604) with the pattern of interconnects (610)and components mounted onto the casing (602). In further embodiments,additional interconnects and components may be mounted on a circuitboard and coupled with the pattern of interconnects (610). For example,economic feasibility may be preserved while weight and size are saved bysome components being mounted on the casing and some components mountedon a modular graphics card, sound card, keyboard components, or thelike.

FIG. 7 depicts an example of a flow chart (700) to imprint interconnectsand mount components onto a hardware casing. Flow chart (700) beginswith a decision in element 702 to determine whether to applyinterconnects directly to the casing. In particular, when the casing isa regular, non-conductive surface, a pattern of interconnects may bepainted or imprinted directly onto the casing (element 704). Forexample, interconnects may be painted, mesh screened, etched from acoated metal, or the like, to be applied to the casing.

In some embodiments, the application of interconnects to the surface ofthe casing may depend upon the topography of the surface and, in furtherembodiments, interconnects are imprinted both on the casing and on alaminate in different parts of the casing in combination. Where theinterconnects are applied and components are mounted may depend onfactors such as if the surface to be applied onto is curved, a laminatemay be elected. For instance, when the surface of the casing isirregular or the interconnects are to be applied around a corner of thecasing, the interconnects may be painted onto a laminate (element 708)and the laminate may be fixed to the surface of the casing (element710).

Similarly, when the casing is a conductive surface, the pattern ofinterconnects may be applied to a non-conductive laminate (element 708)and the non-conductive laminate may be attached to the surface of thecasing (element 710). For example the laminate may be glued, screwed,riveted, shrink-wrapped, or the like, to the casing (element 710). Inother embodiments, a wiring path may be etched out of the laminate.

After interconnects have been manufactured into the casing viaimprinting, laminating, or both, and if more interconnects areincorporated into a design in layers, multiple layers may bemanufactured into the casing. In many embodiments, mounts are thencoupled with the casing and with the pattern of interconnects. Mountsmay couple with the pattern of interconnects and provide a standardinterface to plug in components such as processors, memory, memorycards, or the like.

Element 712 poses a decision of whether another layer of interconnectsis to be added. If another layer is to be added, then flow chart (700)proceeds back to element 702; otherwise, flow chart (700) proceeds toelement 714.

Once a pattern of interconnects and possibly mounts are attached to thecasing, separately manufactured components are mounted onto the casingto add functionality to the device (element 714). Components may serveto add functionality, for example, a speaker or microphone capability onan audio recorder, such as the audio recorder in FIG. 1.

Components may include, for instance, sensors. If one or more sensorsare included, then sensors of the design may be mounted on the casing sothat the sensors may be accessibly exposed to the exterior of thedevice. In this way, the sensors may gather readings of environmentalconditions and also may be connected to the circuitry through thecasing. Thus, in element 714, the sensors may be connected through thecasing to the pattern of interconnects.

In several embodiments, the interconnects and components may beprotected from moisture and contaminants by application of a conformalcoating, such as an acrylic-based, epoxy-based, urethane-based,paraxylylene-based and silicone-based material. Because conformalcoatings aid to prevent short circuits and corrosion of conductors andsolder joints, conformal coatings are often applied over electroniccircuitry in a thin layer, for example, typically a few mils. In someembodiments, a conformal coating is applied by dipping the hardwarecasing surface in a conformal coating solution. In other embodiments,conformal coatings may be applied through spraying the conformal coatingonto the hardware casing surface. In further embodiments, a conformalcoating is applied by select coating, or a simple flow or brush coating.To ensure complete coverage on the interior surface of the hardwarecasing, conformal coatings may contain additives that allow easy UVinspection, for example, Dow Corning's silicone conformal coatings.

In addition, conformal coatings also provide protection of theinsulation resistance of the circuit board and may provide stressrelief. For stress relief, companies such as Dow Corning offer siliconeconformal coatings that cure with a rubbery, elastomeric surface. Thesematerials are solventless with both room-temperature andheat-accelerated cures. Finally, to repair a component or interconnecton the hardware casing, a conformal coating may be removed by usingsolvent-swell, mechanical abrasion, or standard burn-through techniques.

It will be apparent to those skilled in the art having the benefit ofthis disclosure that the present invention contemplates methods andarrangements for applying a pattern of interconnects and mounting one ormore components to a hardware casing. It is understood that the form ofthe invention shown and described in the detailed description and thedrawings are to be taken merely as examples. It is intended that thefollowing claims be interpreted broadly to embrace all the variations ofthe example embodiments disclosed.

1. A method for mounting components to a hardware casing for a device,comprising: determining a pattern of interconnects to apply to aninterior surface of the hardware casing, the pattern comprising at leastone independent path for transmitting a signal between the components,wherein the pattern is designed for mounting the components to theinterior surface based upon a topography of the interior surface; andapplying the pattern of interconnects to the interior surface, theapplication being configured for the interior surface to couple thecomponents with the pattern of interconnects based upon the topographyof the interior surface.
 2. The method of claim 1, further comprisingcoupling the components to the interior surface to mount the componentsto the hardware casing, the components being manufactured independentlyfrom the device.
 3. The method of claim 2, wherein coupling thecomponents to the interior surface comprises mounting a sensor to thehardware casing to couple the sensor with the pattern of interconnects.4. The method of claim 3, wherein mounting the sensor comprises mountingthe sensor to the interior surface of the hardware casing to senseenvironmental conditions via the hardware casing.
 5. The method of claim2, wherein coupling the components to the interior surface comprisescoupling the components to the hardware casing to dissipate heatgenerated by the components via contact with the hardware casing.
 6. Themethod of claim 1, wherein determining comprises adapting the pattern ofinterconnects for application on to the interior surface, wherein thepattern of interconnects is designed for application on to a circuitboard.
 7. The method of claim 1, wherein applying comprises applying asecond layer of material over the pattern of interconnects, wherein thesecond layer comprises a non-conductive material, a second pattern ofinterconnects, and a connection to the first pattern of interconnects.8. The method of claim 1, wherein applying comprises attaching a mountto the interior surface, the mount being coupled with the pattern ofinterconnects and being adapted to couple the pattern of interconnectswith a component of the components.
 9. The method of claim 1, whereinapplying comprises painting the pattern of interconnects onto theinterior surface with a conductive material, wherein the interiorsurface is a substantially non-conductive material.
 10. The method ofclaim 9, wherein painting comprises applying the pattern ofinterconnects to the surface via mesh screening.
 11. The method of claim1, wherein applying the pattern of interconnects to the laminatecomprises applying the pattern of interconnects to a non-conductive filmand fixing the film to the hardware casing.
 12. The method of claim 1,wherein applying comprises coating the interior surface with a sheet ofmetal, printing wire patterns onto the metal using a compound thatresists etching, and subjecting the metal to a chemical etching processthat removes all exposed metal.
 13. A system comprising: hardware todetermine a pattern of interconnects to apply to an interior surface ofa hardware casing, the pattern comprising at least one independent pathfor transmitting a signal between the components, wherein the pattern isdesigned for mounting the components to the interior surface based upona topography of the interior surface; and a circuit manufacture machineto apply the pattern of interconnects to the interior surface, theapplication being configured for the interior surface to couple thecomponents with the pattern of interconnects based upon the topographyof the interior surface.
 14. The system of claim 13, wherein thehardware is to use a software program.
 15. The system of claim 13,wherein the circuit manufacture machine is adapted to couple mountingsites with the pattern of interconnects to mount the components to theinterior surface.
 16. The system of claim 13, wherein the circuitmanufacture machine is adapted to apply the pattern of interconnects asa conductive paint directly to the hardware casing.
 17. The system ofclaim 13, w wherein the circuit manufacture machine is adapted to applythe pattern of interconnects as at least one layer of non-conductivelaminates.
 18. The system of claim 13, wherein the circuit manufacturemachine is adapted to apply a layer of metal to the interior surface ofthe hardware casing and to etch portions of the layer of metal away toreveal the pattern of interconnects.
 19. A medium comprising a softwareprogram to control operation of a circuit manufacture machine, theoperation comprising: determining a pattern of interconnects to apply toan interior surface of the hardware casing, the pattern comprising atleast one independent path for transmitting a signal between thecomponents, wherein the pattern is designed for mounting the componentsto the interior surface based upon a topography of the interior surface;and applying the pattern of interconnects to the interior surface, theapplication being configured for the interior surface to couple thecomponents with the pattern of interconnects based upon the topographyof the interior surface.
 20. The method of claim 1, further comprisingcoupling the components to the interior surface to mount the componentsto the hardware casing, the components being manufactured independentlyfrom the device.